Fairchild Semiconductor Adopts PDF Solutions(R) Exensio(TM) -Test Module for Global Test Operations
Posted OnJuly 9, 2016 by Shruthi S
Fairchild Improves Operational Efficiency and Yield Through Deployment of PDF Solutions' Integrated Exensio(TM) Platform
PDF Solutions, Inc., the leading provider of yield improvement technologies and services for the integrated circuit (IC) process life cycle, today announced that Fairchild Semiconductor has extended its existing PDF Solutions® Exensio(tm) -Yield installation by adopting the Exensio(tm) -Test module. The decision came after PDF Solutions engaged with Fairchild in an extensive on-site pilot program, in which all the capabilities of the Exensio -Test module were demonstrated, giving Fairchild the ability to obtain the synergies from the integrated Exensio -Yield and Exensio -Test solutions.
"During the pilot phase, we were able to significantly improve our test operations efficiency and first pass yield using the Exensio dashboarding capability," said Dr. Wei-Chung Wang, Fairchild Senior Vice President of Manufacturing Operations. "The number of units per day per tester improved by 30% on key, high-volume products. First pass yield improved 10-20% by direct retest and reprobe."
PDF Solutions Exensio -Test module -- augmented with new dashboarding capabilities that are designed to be powerful and easy-to-use, and with significantly enhanced integration within the Exensio -Test module and across the entire Exensio Platform -- is designed to give Fairchild near real-time visibility and control of their test operations. "By leveraging the existing Exensio -Yield installation and focusing on integrating new and existing components of the Exensio -Test module, we were able to improve significantly both the overall efficiency and yield of Fairchild's test operations," stated Said Akar, General Manager of PDF Solutions' Volume Manufacturing Solutions group. "Whereas other solutions focus on specific steps in the manufacturing process, our Exensio Platform solution is built to span the entire semiconductor manufacturing value chain, from in-fab processing through wafer-sort, assembly and final-test. This capability is designed to give customers unique insight by providing a much broader view of the factors driving yield."
To learn more about the PDF Solutions Exensio Platform and how it can help your company improve efficiency and manufacturing yield, please contact email@example.com.
About the Exensio Platform
The Exensio platform is a big data analytics infrastructure designed to provide highly-scalable, high-performance infrastructure for storage, communication, automation and the handling of both industry-specific and PDF Solutions' proprietary data types. Designed and developed specifically for the semiconductor industry, Exensio solutions have an installed base of more than 19,000 users at leading fabs, fabless and test and assembly houses around the world. Exensio modules built on the platform include: Exensio -Yield, Exensio -Control, Exensio -Test, and Exensio -Hosted, Exensio -Char. The Exensio -Yield module provides yield management technology and, when used together with the Exensio -Control module that provides fault detection and classification (FDC), results in world-class variability control in manufacturing. The Exensio -Test module leverages integration and analysis technology that produces diagnostic and predictive information that can be used to further optimize semiconductor yields and operational performance. The Exensio -Hosted module is a SaaS (Software as a Service), cloud-based yield management system for fabless semiconductor companies that provides powerful characterization to accelerate new product introductions (NPI) and high visibility to test floor operation. The Exensio -Char module drives extensive process characterization and benchmarking capabilities through electrical test chip infrastructure.
About PDF Solutions
PDF Solutions, Inc. (NASDAQ: PDFS) is the leading provider of yield improvement technologies and services for the IC manufacturing process life cycle. PDF Solutions offers solutions that are designed to enable clients to lower costs of IC design and manufacture, enhance time to market, and improve profitability by addressing design and manufacturing interactions from product design to initial process ramps to mature manufacturing operations. PDF Solutions' Characterization Vehicle® (CV®) electrical test chip infrastructure provides the core modeling capabilities, and is used by more leading manufacturers than any other test chips in the industry. Proprietary Template(tm) layout patterns provide optimum area, performance, and manufacturability for designing IC products. Exensio is a big data analytics platform designed to provide highly-scalable, high-performance infrastructure for storage, communication, automation and the handling of both industry-specific and PDF Solutions' proprietary data types. Headquartered in San Jose, Calif., PDF Solutions operates worldwide with additional offices in Canada, China, France, Germany, Italy, Japan, Korea, and Taiwan. For the Company's latest news and information, visit http://www.pdf.com/.